LED Chip-Products
Cree’s Direct AttachTM SA1000TM LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology to deliver superior value for the general illumination and automotive exterior markets. The SA1000 LEDs are among the brightest in the market at a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-down design allows for eutectic die attach, eliminating the need for wire bonds, enabling superior performance, improved thermal management and high reliabilty. The design is optimally suited for industry-standard top-view packages.
Go to see more：https://www.cree.com/led-chips/products/da-leds/sa1000
Go to see more：https://www.cree.com/led-chips/products/da-leds/sa1000
Cree's EZBright(R) LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree's proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these LEDs are die attachable with conductive epoxy, solder paste or solder preforms, as well as the eutectic method. These vertically structured, low forward voltage LED chips are approximately 170 microns in height. Cree's EZTM chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad range of applications, such as general illumination, automotive lighting and LCD backlighting.
Go to see more：https://www.cree.com/led-chips/products/ez-n-leds/ez290-n
Go to see more：https://www.cree.com/led-chips/products/ez-n-leds/ez290-n
Cree’s EZBright(R) LEDs are the latest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. EZTM LEDs are attachable with the flux eutectic method, as well as conductive epoxy, solder paste or solder preforms. These vertically structured, low forward voltage LED chips are available in standard or reduced height. Cree’s EZ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad range of applications, including automotive lighting, wearable devices, video displays and LCD backlighting.
Go to see more：https://www.cree.com/led-chips/products/ez-p-leds/ez400-p
Go to see more：https://www.cree.com/led-chips/products/ez-p-leds/ez400-p
Cree’s low-current SuperBlueTM Generation II LEDs combine highly efficient GaN with Cree’s proprietary GoSiC(R) substrate to deliver the ultimate price/performance for blue LEDs. The C430CB230-S2100 is designed for automotive applications or any application where wavelength stability and chip robustness are critical.
Go to see more：https://www.cree.com/led-chips/products/gan-leds/cb290
Go to see more：https://www.cree.com/led-chips/products/gan-leds/cb290
Cree’s MB Generation II series of MegaBright(R) LEDs combine highly efficient InGaN materials with Cree’s proprietary GoSiC(R) substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced vertical chip structure to maximize light extraction efficiency and require only a single wire bond connection. Sorted die kits provide die sheets conveniently sorted into wavelength and radiant flux bins. Cree’s MB series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000V ESD. These LEDs are useful in a broad range of applications such as outdoor full-motion LED video signs, automotive lighting and white LEDs, yet can also be used in high-volume applications such as LCD backlighting. Cree’s MB series chips are compatible with most radial and SMT LED assembly processes.
Go to see more：https://www.cree.com/led-chips/products/mb-leds/mb290
Go to see more：https://www.cree.com/led-chips/products/mb-leds/mb290
Cree’s RazerThin(R) LEDs are a new generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary GoSiC(R) substrate to deliver superior price/performance for high-intensity blue and green LEDs. These vertically structured LED chips are approximately 95 microns in height and require a low forward voltage. Cree’s RazerThin(R) series chips have the ability to withstand 1000 V ESD.
Go to see more：https://www.cree.com/led-chips/products/rt-leds/rt200
Go to see more：https://www.cree.com/led-chips/products/rt-leds/rt200
Cree’s TRTM LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology and silicon carbide substrates to deliver superior value for the LCD sideview market. The TR LEDs are among the brightest in the sideview market while delivering a low forward voltage resulting in a very bright and highly efficient solution for the 0.4-mm, 0.6-mm and 0.8-mm sideview market. The design is optimally suited for industry-standard sideview packages as it is die attachable with clear epoxy and has two top contacts, consistent with industry-standard packaging.
Go to see more：https://www.cree.com/led-chips/products/tr-leds/tr1823
Go to see more：https://www.cree.com/led-chips/products/tr-leds/tr1823
Cree’s UltraThinTM LEDs combine highly efficient InGaN materials with Cree’s proprietary GoSiC(R) substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UTTM series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000-V ESD. Applications include keypad backlighting where sub-miniaturization and thinner form factors are required.
Go to see more：https://www.cree.com/led-chips/products/ut-leds/ut170
Go to see more：https://www.cree.com/led-chips/products/ut-leds/ut170
